Semiconductor device manufacturing method

A semiconductor device manufacturing method of forming a trench and a via in a porous low dielectric constant film formed on a substrate as an interlayer insulating film, includes: embedding a polymer having a urea bond in pores of the porous low dielectric constant film by supplying a raw material...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Yatsuda, Koichi, Lazzarino, Frederic, Babaei Gavan, Khashayar, Yamaguchi, Tatsuya, Feurprier, Yannick, de Marneffe, Jean-Francois
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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