Methods for attachment and devices produced using the methods
Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the...
Gespeichert in:
Hauptverfasser: | , , , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | Desai, Nitin Lifton, Anna Marczi, Michael T Singh, Bawa Khaselev, Oscar Boureghda, Monnir |
description | Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10905041B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10905041B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10905041B23</originalsourceid><addsrcrecordid>eNrjZLD1TS3JyE8pVkjLL1JILClJTM7ITc0rUUjMS1FISS3LTE4tVigoyk8pTU5NUSgtzsxLVyjJSFXIhejiYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxocGGBpYGpgYmhk5GxsSoAQAkWDBL</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Methods for attachment and devices produced using the methods</title><source>esp@cenet</source><creator>Desai, Nitin ; Lifton, Anna ; Marczi, Michael T ; Singh, Bawa ; Khaselev, Oscar ; Boureghda, Monnir</creator><creatorcontrib>Desai, Nitin ; Lifton, Anna ; Marczi, Michael T ; Singh, Bawa ; Khaselev, Oscar ; Boureghda, Monnir</creatorcontrib><description>Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CASTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MAKING METALLIC POWDER ; MANUFACTURE OF ARTICLES FROM METALLIC POWDER ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; POWDER METALLURGY ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; TRANSPORTING ; WORKING METALLIC POWDER</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210126&DB=EPODOC&CC=US&NR=10905041B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210126&DB=EPODOC&CC=US&NR=10905041B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Desai, Nitin</creatorcontrib><creatorcontrib>Lifton, Anna</creatorcontrib><creatorcontrib>Marczi, Michael T</creatorcontrib><creatorcontrib>Singh, Bawa</creatorcontrib><creatorcontrib>Khaselev, Oscar</creatorcontrib><creatorcontrib>Boureghda, Monnir</creatorcontrib><title>Methods for attachment and devices produced using the methods</title><description>Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CASTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MAKING METALLIC POWDER</subject><subject>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PERFORMING OPERATIONS</subject><subject>POWDER METALLURGY</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><subject>WORKING METALLIC POWDER</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLD1TS3JyE8pVkjLL1JILClJTM7ITc0rUUjMS1FISS3LTE4tVigoyk8pTU5NUSgtzsxLVyjJSFXIhejiYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxocGGBpYGpgYmhk5GxsSoAQAkWDBL</recordid><startdate>20210126</startdate><enddate>20210126</enddate><creator>Desai, Nitin</creator><creator>Lifton, Anna</creator><creator>Marczi, Michael T</creator><creator>Singh, Bawa</creator><creator>Khaselev, Oscar</creator><creator>Boureghda, Monnir</creator><scope>EVB</scope></search><sort><creationdate>20210126</creationdate><title>Methods for attachment and devices produced using the methods</title><author>Desai, Nitin ; Lifton, Anna ; Marczi, Michael T ; Singh, Bawa ; Khaselev, Oscar ; Boureghda, Monnir</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10905041B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CASTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MAKING METALLIC POWDER</topic><topic>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PERFORMING OPERATIONS</topic><topic>POWDER METALLURGY</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><topic>WORKING METALLIC POWDER</topic><toplevel>online_resources</toplevel><creatorcontrib>Desai, Nitin</creatorcontrib><creatorcontrib>Lifton, Anna</creatorcontrib><creatorcontrib>Marczi, Michael T</creatorcontrib><creatorcontrib>Singh, Bawa</creatorcontrib><creatorcontrib>Khaselev, Oscar</creatorcontrib><creatorcontrib>Boureghda, Monnir</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Desai, Nitin</au><au>Lifton, Anna</au><au>Marczi, Michael T</au><au>Singh, Bawa</au><au>Khaselev, Oscar</au><au>Boureghda, Monnir</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Methods for attachment and devices produced using the methods</title><date>2021-01-26</date><risdate>2021</risdate><abstract>Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_epo_espacenet_US10905041B2 |
source | esp@cenet |
subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS POWDER METALLURGY PRINTED CIRCUITS SEMICONDUCTOR DEVICES TRANSPORTING WORKING METALLIC POWDER |
title | Methods for attachment and devices produced using the methods |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-20T01%3A06%3A59IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Desai,%20Nitin&rft.date=2021-01-26&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS10905041B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |