Methods for attachment and devices produced using the methods

Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the...

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Hauptverfasser: Desai, Nitin, Lifton, Anna, Marczi, Michael T, Singh, Bawa, Khaselev, Oscar, Boureghda, Monnir
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creator Desai, Nitin
Lifton, Anna
Marczi, Michael T
Singh, Bawa
Khaselev, Oscar
Boureghda, Monnir
description Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.
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subjects BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CASTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MAKING METALLIC POWDER
MANUFACTURE OF ARTICLES FROM METALLIC POWDER
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
POWDER METALLURGY
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
TRANSPORTING
WORKING METALLIC POWDER
title Methods for attachment and devices produced using the methods
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