Contact pads for electronic substrates and related methods
Electronic substrates, contact pads for electronic substrates, and related methods are disclosed. Electronic substrates may include an electrically conductive layer that forms at least one contact pad and at least one metal trace on a non-conductive layer. The contact pads are arranged with greater...
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| creator | Orlowski, John August Morris, Thomas Scott Jandzinski, David |
| description | Electronic substrates, contact pads for electronic substrates, and related methods are disclosed. Electronic substrates may include an electrically conductive layer that forms at least one contact pad and at least one metal trace on a non-conductive layer. The contact pads are arranged with greater thicknesses or heights above the non-conductive layer than the metal traces. Dielectric layers are disclosed that cover the metal traces while leaving top surfaces of the contact pads exposed. Top surfaces of the dielectric layers may be arranged to be coplanar with top surfaces of the contact pads to provide electronic substrates having generally planar top faces. Bottom faces of electronic substrates may include mounting pads that are coplanar with additional dielectric layers. Methods are disclosed that include forming dielectric layers to cover contact pads and metal traces, and removing surface portions of the dielectric layers until the contact pads are accessible through the dielectric layers. |
| format | Patent |
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Methods are disclosed that include forming dielectric layers to cover contact pads and metal traces, and removing surface portions of the dielectric layers until the contact pads are accessible through the dielectric layers.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210126&DB=EPODOC&CC=US&NR=10905007B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210126&DB=EPODOC&CC=US&NR=10905007B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Orlowski, John August</creatorcontrib><creatorcontrib>Morris, Thomas Scott</creatorcontrib><creatorcontrib>Jandzinski, David</creatorcontrib><title>Contact pads for electronic substrates and related methods</title><description>Electronic substrates, contact pads for electronic substrates, and related methods are disclosed. 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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Contact pads for electronic substrates and related methods |
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