Method for providing a hermetically sealed feedthrough with co-fired filled via for an active implantable medical device

A method for making a dielectric substrate configured for incorporation into a hermetically sealed feedthrough is described. The method includes forming a via hole through a green-state dielectric substrate. A platinum-containing paste is filled into at least 90% of the volume of the via hole. The g...

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Bibliographische Detailangaben
Hauptverfasser:	Tang, Xiaohong, Marzano, Thomas, Frustaci, Dominick J, Frysz, Christine A, Woods, Jason, Seitz, Keith W, Stevenson, Robert A, Brendel, Richard L, Thiebolt, William C, Winn, Steven W
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CASTING CHEMISTRY CURRENT COLLECTORS ELECTRICITY ELECTROTHERAPY FERROUS OR NON-FERROUS ALLOYS HUMAN NECESSITIES HYGIENE LINE CONNECTORS MAGNETOTHERAPY MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER MEDICAL OR VETERINARY SCIENCE METALLURGY PERFORMING OPERATIONS POWDER METALLURGY RADIATION THERAPY TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS ULTRASOUND THERAPY WORKING METALLIC POWDER
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