Top-side connector interface for processor packaging
An apparatus is provided which comprises: a processor die; a processor substrate having a region extended away from the processor die, wherein the processor die is mounted on the processor substrate, wherein the extended region has at least one signal interface which is connectable to a top-side con...
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| creator | Thibado, Jonathan W Smalley, Jeffory L Aoki, Russell S |
| description | An apparatus is provided which comprises: a processor die; a processor substrate having a region extended away from the processor die, wherein the processor die is mounted on the processor substrate, wherein the extended region has at least one signal interface which is connectable to a top-side connector; and an interposer coupled to the processor substrate and a motherboard. |
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| subjects | BASIC ELECTRIC ELEMENTS CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING CURRENT COLLECTORS ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Top-side connector interface for processor packaging |
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