Structure and method for sealing through-hole, and transfer substrate for sealing through-hole

A sealing structure with a surface of a base material with a through-hole, an underlying metal film, and a sealing member bonded to the underlying metal film to seal the through-hole. The sealing member includes a compressed product of a metal powder including gold having a purity of 99.9% by mass o...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Ogashiwa, Toshinori, Miyairi, Masayuki, Sasaki, Yuya, Inoue, Kenichi
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS POWDER METALLURGY PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TRANSPORTING WORKING METALLIC POWDER
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