Component having boundary element

Component having boundary element

A component having a boundary element is disclosed. In an embodiment a component comprises a semiconductor chip, a housing and a reflective layer, wherein the housing has a shaped body and a base body, the shaped body laterally enclosing the base body at least in places and being different from the...

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Hauptverfasser: Prakash, Rajah, Lim, Choo Kean, Ooi, Chee-Eng, Betthausen, Christian, Chan, Weng Heng, Ithnain, Ismail, Wong, Teik Yee, Soong, Chee Weng
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Prakash, Rajah
Lim, Choo Kean
Ooi, Chee-Eng
Betthausen, Christian
Chan, Weng Heng
Ithnain, Ismail
Wong, Teik Yee
Soong, Chee Weng
description A component having a boundary element is disclosed. In an embodiment a component comprises a semiconductor chip, a housing and a reflective layer, wherein the housing has a shaped body and a base body, the shaped body laterally enclosing the base body at least in places and being different from the reflective layer. In a plan view, the base body has a free area which is uncovered by the shaped body. The free area or a bottom surface of a cavity comprises a mounting surface for the semiconductor chip, wherein the semiconductor chip is arranged on the mounting surface. The bottom surface or the free area is partially covered by the reflective layer, wherein the mounting surface is enclosed at least in regions by a boundary element which adjoins the reflective layer and is configured to prevent the semiconductor chip from being covered by the reflective layer.
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In an embodiment a component comprises a semiconductor chip, a housing and a reflective layer, wherein the housing has a shaped body and a base body, the shaped body laterally enclosing the base body at least in places and being different from the reflective layer. In a plan view, the base body has a free area which is uncovered by the shaped body. The free area or a bottom surface of a cavity comprises a mounting surface for the semiconductor chip, wherein the semiconductor chip is arranged on the mounting surface. 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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Component having boundary element
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