Solid-state image pickup device and method for manufacturing the same, and electronic apparatus
The present disclosure relates to a solid-state image pickup device and a method for manufacturing the same, and an electronic apparatus, capable of suppressing color mixture, stray light, reduction in contour resolution, and the like. A solid-state image pickup device includes: a light shielding bo...
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| creator | Hikichi, Kunihiko Yamamoto, Atsushi |
| description | The present disclosure relates to a solid-state image pickup device and a method for manufacturing the same, and an electronic apparatus, capable of suppressing color mixture, stray light, reduction in contour resolution, and the like. A solid-state image pickup device includes: a light shielding body having light shielding walls and a light transmitting portion formed in an opening portion between the light shielding walls; a first light shielding layer which is formed on an incident surface side of light of the light shielding body, and has an opening portion narrower than the opening portion of the light shielding body for each of the opening portions of the light shielding body; a microlens provided on the incident surface side of light of the light shielding body and for each of the opening portions of the first light shielding layer; a light receiving element layer in which a large number of light receiving elements which perform photoelectric conversion in accordance with incident light condensed by the microlens and input via the light transmitting portion of the light shielding body are arranged; and a second light shielding layer which is formed on the light receiving element layer side of the light shielding body, and has an opening portion narrower than the opening portion of the light shielding body and wider than the first light shielding layer for each of the opening portions of the light shielding body. The present disclosure can be used for a compound eye optical system, for example. |
| format | Patent |
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A solid-state image pickup device includes: a light shielding body having light shielding walls and a light transmitting portion formed in an opening portion between the light shielding walls; a first light shielding layer which is formed on an incident surface side of light of the light shielding body, and has an opening portion narrower than the opening portion of the light shielding body for each of the opening portions of the light shielding body; a microlens provided on the incident surface side of light of the light shielding body and for each of the opening portions of the first light shielding layer; a light receiving element layer in which a large number of light receiving elements which perform photoelectric conversion in accordance with incident light condensed by the microlens and input via the light transmitting portion of the light shielding body are arranged; and a second light shielding layer which is formed on the light receiving element layer side of the light shielding body, and has an opening portion narrower than the opening portion of the light shielding body and wider than the first light shielding layer for each of the opening portions of the light shielding body. The present disclosure can be used for a compound eye optical system, for example.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PHYSICS ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201201&DB=EPODOC&CC=US&NR=10854664B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201201&DB=EPODOC&CC=US&NR=10854664B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Hikichi, Kunihiko</creatorcontrib><creatorcontrib>Yamamoto, Atsushi</creatorcontrib><title>Solid-state image pickup device and method for manufacturing the same, and electronic apparatus</title><description>The present disclosure relates to a solid-state image pickup device and a method for manufacturing the same, and an electronic apparatus, capable of suppressing color mixture, stray light, reduction in contour resolution, and the like. A solid-state image pickup device includes: a light shielding body having light shielding walls and a light transmitting portion formed in an opening portion between the light shielding walls; a first light shielding layer which is formed on an incident surface side of light of the light shielding body, and has an opening portion narrower than the opening portion of the light shielding body for each of the opening portions of the light shielding body; a microlens provided on the incident surface side of light of the light shielding body and for each of the opening portions of the first light shielding layer; a light receiving element layer in which a large number of light receiving elements which perform photoelectric conversion in accordance with incident light condensed by the microlens and input via the light transmitting portion of the light shielding body are arranged; and a second light shielding layer which is formed on the light receiving element layer side of the light shielding body, and has an opening portion narrower than the opening portion of the light shielding body and wider than the first light shielding layer for each of the opening portions of the light shielding body. The present disclosure can be used for a compound eye optical system, for example.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrsKwjAUBuAuDqK-w3G34KUWZ0Vxr87lkPxtg7mRnPj8gvgATt_yzau-C9boOgsLyDgeQdGoV4mk8TYKxF6Tg0xB0xASOfZlYCUlGT-STKDMDptvg4WSFLxRxDFyYil5Wc0Gthmrn4tqfbs-LvcaMfTIkRU8pH92u-3p2LRtc94f_jkfX1g89A</recordid><startdate>20201201</startdate><enddate>20201201</enddate><creator>Hikichi, Kunihiko</creator><creator>Yamamoto, Atsushi</creator><scope>EVB</scope></search><sort><creationdate>20201201</creationdate><title>Solid-state image pickup device and method for manufacturing the same, and electronic apparatus</title><author>Hikichi, Kunihiko ; Yamamoto, Atsushi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10854664B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Hikichi, Kunihiko</creatorcontrib><creatorcontrib>Yamamoto, Atsushi</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Hikichi, Kunihiko</au><au>Yamamoto, Atsushi</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Solid-state image pickup device and method for manufacturing the same, and electronic apparatus</title><date>2020-12-01</date><risdate>2020</risdate><abstract>The present disclosure relates to a solid-state image pickup device and a method for manufacturing the same, and an electronic apparatus, capable of suppressing color mixture, stray light, reduction in contour resolution, and the like. A solid-state image pickup device includes: a light shielding body having light shielding walls and a light transmitting portion formed in an opening portion between the light shielding walls; a first light shielding layer which is formed on an incident surface side of light of the light shielding body, and has an opening portion narrower than the opening portion of the light shielding body for each of the opening portions of the light shielding body; a microlens provided on the incident surface side of light of the light shielding body and for each of the opening portions of the first light shielding layer; a light receiving element layer in which a large number of light receiving elements which perform photoelectric conversion in accordance with incident light condensed by the microlens and input via the light transmitting portion of the light shielding body are arranged; and a second light shielding layer which is formed on the light receiving element layer side of the light shielding body, and has an opening portion narrower than the opening portion of the light shielding body and wider than the first light shielding layer for each of the opening portions of the light shielding body. The present disclosure can be used for a compound eye optical system, for example.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS SEMICONDUCTOR DEVICES |
| title | Solid-state image pickup device and method for manufacturing the same, and electronic apparatus |
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