Multi-chip module hybrid integrated circuit with multiple power zones that provide cold spare support

A multi-chip module hybrid integrated circuit (MCM-HIC) provides cold spare support to an apparatus comprising a plurality of ICs and/or other circuits that are not cold spare compliant. At least one core IC and at least one cold spare chiplet are installed on an interconnecting substrate having a p...

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Bibliographische Detailangaben
Hauptverfasser: Gilliam, Jane O, Sturcken, Keith K, Bernard, Jamie A, Rickard, Dale A, Dennis, Lori D, Ross, Jason F, Dennis, Alan F
Format: Patent
Sprache:eng
Schlagworte:
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