Semiconductor package including organic interposer

A semiconductor package including an organic interposer includes: first and second semiconductor chips each having active surfaces having connection pads disposed thereon; the organic interposer disposed on the active surfaces of the first and second semiconductor chips and including a wiring layer...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Kim, Yeong A, Kim, Eun Sil, Kuroyanagi, Akihisa, Myung, Jun Woo
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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