Microelectromechanical systems (MEMS) and methods
The present disclosure relates to a method of fabricating a reflector, the reflector being at least partially reflective and at least partially transmissive for at least a wavelength of electromagnetic radiation; the method comprising: forming a first material layer defining a bottom layer; forming...
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creator | Faraone, Lorenzo Tripathi, Dhirendra Silva, Dilusha Dell, John Marcel Antoszewski, Jarek Martyniuk, Mariusz |
description | The present disclosure relates to a method of fabricating a reflector, the reflector being at least partially reflective and at least partially transmissive for at least a wavelength of electromagnetic radiation; the method comprising: forming a first material layer defining a bottom layer; forming a sacrificial layer on the bottom layer; forming a second material layer defining a top layer on the sacrificial layer and a supporting structure connected to the bottom layer; and removing at least part of the sacrificial layer to form a cavity between the bottom layer and the top layer such that the supporting structure supports the top layer relative to the bottom layer and no further supporting structure is provided within the cavity, wherein after the at least part of the sacrificial layer is removed, at least the top layer has residual tensile stress. |
format | Patent |
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the method comprising: forming a first material layer defining a bottom layer; forming a sacrificial layer on the bottom layer; forming a second material layer defining a top layer on the sacrificial layer and a supporting structure connected to the bottom layer; and removing at least part of the sacrificial layer to form a cavity between the bottom layer and the top layer such that the supporting structure supports the top layer relative to the bottom layer and no further supporting structure is provided within the cavity, wherein after the at least part of the sacrificial layer is removed, at least the top layer has residual tensile stress.</description><language>eng</language><subject>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES ; MICROSTRUCTURAL TECHNOLOGY ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PERFORMING OPERATIONS ; PHYSICS ; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS ; TRANSPORTING</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201201&DB=EPODOC&CC=US&NR=10850974B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201201&DB=EPODOC&CC=US&NR=10850974B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Faraone, Lorenzo</creatorcontrib><creatorcontrib>Tripathi, Dhirendra</creatorcontrib><creatorcontrib>Silva, Dilusha</creatorcontrib><creatorcontrib>Dell, John Marcel</creatorcontrib><creatorcontrib>Antoszewski, Jarek</creatorcontrib><creatorcontrib>Martyniuk, Mariusz</creatorcontrib><title>Microelectromechanical systems (MEMS) and methods</title><description>The present disclosure relates to a method of fabricating a reflector, the reflector being at least partially reflective and at least partially transmissive for at least a wavelength of electromagnetic radiation; 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the method comprising: forming a first material layer defining a bottom layer; forming a sacrificial layer on the bottom layer; forming a second material layer defining a top layer on the sacrificial layer and a supporting structure connected to the bottom layer; and removing at least part of the sacrificial layer to form a cavity between the bottom layer and the top layer such that the supporting structure supports the top layer relative to the bottom layer and no further supporting structure is provided within the cavity, wherein after the at least part of the sacrificial layer is removed, at least the top layer has residual tensile stress.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PERFORMING OPERATIONS PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TRANSPORTING |
title | Microelectromechanical systems (MEMS) and methods |
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