Semiconductor package with leadframe having pre-singulated leads or lead terminals

Semiconductor package with leadframe having pre-singulated leads or lead terminals

A packaged semiconductor device includes at least one semiconductor die having circuitry with circuit nodes coupled to bond pads that have bonding features thereon. A plurality of leads or lead terminals include at least metal bars, wherein the plurality of leads or lead terminals are exclusive of a...

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Hauptverfasser: Manack, Christopher Daniel, Glasscock, Bradley Andrew, Wyant, Michael Todd
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Manack, Christopher Daniel
Glasscock, Bradley Andrew
Wyant, Michael Todd
description A packaged semiconductor device includes at least one semiconductor die having circuitry with circuit nodes coupled to bond pads that have bonding features thereon. A plurality of leads or lead terminals include at least metal bars, wherein the plurality of leads or lead terminals are exclusive of any saw marks. The semiconductor die is flipchip attached with a bonded connection between respective bonding features and respective leads or lead terminals.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Semiconductor package with leadframe having pre-singulated leads or lead terminals
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