Circuit board and method for production thereof

A circuit board (10, 10′, 10″) includes at last one insulating substrate layer (SL1, SL2, SL3, SL4, SL5) and a plurality of electrically conductive copper coats (C1, C2, C3) arranged on the at least one insulating substrate layer (SL1, SL2, SL3, SL4, SL5), wherein at least one of the electrically co...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Neumann, Alexander, Trageser, Hubert
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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