Paddle for use of stirring plating solution and plating apparatus including paddle

According to one embodiment, a plating apparatus for electroplating a substrate including a non-pattern area is provided. The plating apparatus includes a plating tank for holding the plating solution, an anode configured to be connected to a positive electrode of a power supply, and a paddle config...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Kimura, Risa, Shamoto, Mitsuhiro
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY MIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TRANSPORTING
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