Curable and hygroscopic resin composition for sealing electronic devices, resin cured material, and electronic device
Disclosed is a curable hygroscopic resin composition for sealing electronic devices, the composition comprising: (a) a radical-polymerizable compound; (b) a hygroscopic compound including a structure represented by formula (1); and (c) a photoradical polymerization initiator. Also disclosed are a re...
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| creator | Mieda, Tetsuya |
| description | Disclosed is a curable hygroscopic resin composition for sealing electronic devices, the composition comprising: (a) a radical-polymerizable compound; (b) a hygroscopic compound including a structure represented by formula (1); and (c) a photoradical polymerization initiator. Also disclosed are a resin cured product formed by curing said composition, and an electronic device sealed by curing said composition. (In formula (1), R represents (i) an acyl group, (ii) a hydrocarbon group, or (iii) a group including, between a carbon-carbon bond in said hydrocarbon group, at least one type of group selected from the group consisting of -O-, -S-, -CO-, and -NH-. M represents a boron atom or an aluminum atom, n is an integer of from 2 to 20, and *1 and *2 each represent a binding site with a terminal group or are bonded to one another.) |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10829670B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10829670B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10829670B23</originalsourceid><addsrcrecordid>eNqNzLsKwkAQheE0FqK-w9hH0AheWoNir9Zh3EziwGZnmdkIvr0iWtlYneY7_zDry17x6gkw1HB7tCrmJLIDJeMATrooxoklQCMKRug5tECeXFIJL1jTnR1Z_n30SjV0mEgZff7u_uhxNmjQG00-O8qmh_25PM4oSkUW0VGgVF1Oi_mm2K7W812x_Mc8AQo6RZ0</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Curable and hygroscopic resin composition for sealing electronic devices, resin cured material, and electronic device</title><source>esp@cenet</source><creator>Mieda, Tetsuya</creator><creatorcontrib>Mieda, Tetsuya</creatorcontrib><description>Disclosed is a curable hygroscopic resin composition for sealing electronic devices, the composition comprising: (a) a radical-polymerizable compound; (b) a hygroscopic compound including a structure represented by formula (1); and (c) a photoradical polymerization initiator. Also disclosed are a resin cured product formed by curing said composition, and an electronic device sealed by curing said composition. (In formula (1), R represents (i) an acyl group, (ii) a hydrocarbon group, or (iii) a group including, between a carbon-carbon bond in said hydrocarbon group, at least one type of group selected from the group consisting of -O-, -S-, -CO-, and -NH-. M represents a boron atom or an aluminum atom, n is an integer of from 2 to 20, and *1 and *2 each represent a binding site with a terminal group or are bonded to one another.)</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201110&DB=EPODOC&CC=US&NR=10829670B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201110&DB=EPODOC&CC=US&NR=10829670B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Mieda, Tetsuya</creatorcontrib><title>Curable and hygroscopic resin composition for sealing electronic devices, resin cured material, and electronic device</title><description>Disclosed is a curable hygroscopic resin composition for sealing electronic devices, the composition comprising: (a) a radical-polymerizable compound; (b) a hygroscopic compound including a structure represented by formula (1); and (c) a photoradical polymerization initiator. Also disclosed are a resin cured product formed by curing said composition, and an electronic device sealed by curing said composition. (In formula (1), R represents (i) an acyl group, (ii) a hydrocarbon group, or (iii) a group including, between a carbon-carbon bond in said hydrocarbon group, at least one type of group selected from the group consisting of -O-, -S-, -CO-, and -NH-. M represents a boron atom or an aluminum atom, n is an integer of from 2 to 20, and *1 and *2 each represent a binding site with a terminal group or are bonded to one another.)</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNzLsKwkAQheE0FqK-w9hH0AheWoNir9Zh3EziwGZnmdkIvr0iWtlYneY7_zDry17x6gkw1HB7tCrmJLIDJeMATrooxoklQCMKRug5tECeXFIJL1jTnR1Z_n30SjV0mEgZff7u_uhxNmjQG00-O8qmh_25PM4oSkUW0VGgVF1Oi_mm2K7W812x_Mc8AQo6RZ0</recordid><startdate>20201110</startdate><enddate>20201110</enddate><creator>Mieda, Tetsuya</creator><scope>EVB</scope></search><sort><creationdate>20201110</creationdate><title>Curable and hygroscopic resin composition for sealing electronic devices, resin cured material, and electronic device</title><author>Mieda, Tetsuya</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10829670B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2020</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>Mieda, Tetsuya</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Mieda, Tetsuya</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Curable and hygroscopic resin composition for sealing electronic devices, resin cured material, and electronic device</title><date>2020-11-10</date><risdate>2020</risdate><abstract>Disclosed is a curable hygroscopic resin composition for sealing electronic devices, the composition comprising: (a) a radical-polymerizable compound; (b) a hygroscopic compound including a structure represented by formula (1); and (c) a photoradical polymerization initiator. Also disclosed are a resin cured product formed by curing said composition, and an electronic device sealed by curing said composition. (In formula (1), R represents (i) an acyl group, (ii) a hydrocarbon group, or (iii) a group including, between a carbon-carbon bond in said hydrocarbon group, at least one type of group selected from the group consisting of -O-, -S-, -CO-, and -NH-. M represents a boron atom or an aluminum atom, n is an integer of from 2 to 20, and *1 and *2 each represent a binding site with a terminal group or are bonded to one another.)</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES |
| title | Curable and hygroscopic resin composition for sealing electronic devices, resin cured material, and electronic device |
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