Thin film light emitting diode
A light emitting device can include a light emitting structure including a p-GaN based semiconductor layer, an active layer having multiple quantum wells, and an n-GaN based semiconductor layer; a p-electrode and an n-electrode electrically connecting with the light emitting structure, respectively,...
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creator | Yoo, Myung Cheol |
description | A light emitting device can include a light emitting structure including a p-GaN based semiconductor layer, an active layer having multiple quantum wells, and an n-GaN based semiconductor layer; a p-electrode and an n-electrode electrically connecting with the light emitting structure, respectively, wherein the n-electrode has a plurality of layers; a first passivation layer including a first portion contacting a portion of the n-electrode, a second portion vertically overlapped with the p-electrode, and a third portion that extends outside of outermost side surfaces of the light emitting structure; a phosphor layer disposed on a top surface of the light emitting structure; and a second passivation layer including a first portion disposed between the phosphor layer and the top surface of the light emitting structure, and a second portion disposed on the outermost side surfaces of the light emitting structure, in which the phosphor layer includes a pattern to bond a wire with a p-pad on a portion of the p-electrode, the second portion of the second passivation layer extends toward the third portion of the first passivation and contacts the third portion of the first passivation layer, and the first passivation layer includes an opening on the n-GaN based semiconductor layer such that the opening accommodates at least a portion of the n-electrode. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10825962B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10825962B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10825962B23</originalsourceid><addsrcrecordid>eNrjZJALycjMU0jLzMlVyMlMzyhRSM3NLCnJzEtXSMnMT0nlYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxocGGBhZGppZmRk5GxsSoAQDjOCR0</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Thin film light emitting diode</title><source>esp@cenet</source><creator>Yoo, Myung Cheol</creator><creatorcontrib>Yoo, Myung Cheol</creatorcontrib><description>A light emitting device can include a light emitting structure including a p-GaN based semiconductor layer, an active layer having multiple quantum wells, and an n-GaN based semiconductor layer; a p-electrode and an n-electrode electrically connecting with the light emitting structure, respectively, wherein the n-electrode has a plurality of layers; a first passivation layer including a first portion contacting a portion of the n-electrode, a second portion vertically overlapped with the p-electrode, and a third portion that extends outside of outermost side surfaces of the light emitting structure; a phosphor layer disposed on a top surface of the light emitting structure; and a second passivation layer including a first portion disposed between the phosphor layer and the top surface of the light emitting structure, and a second portion disposed on the outermost side surfaces of the light emitting structure, in which the phosphor layer includes a pattern to bond a wire with a p-pad on a portion of the p-electrode, the second portion of the second passivation layer extends toward the third portion of the first passivation and contacts the third portion of the first passivation layer, and the first passivation layer includes an opening on the n-GaN based semiconductor layer such that the opening accommodates at least a portion of the n-electrode.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201103&DB=EPODOC&CC=US&NR=10825962B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201103&DB=EPODOC&CC=US&NR=10825962B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Yoo, Myung Cheol</creatorcontrib><title>Thin film light emitting diode</title><description>A light emitting device can include a light emitting structure including a p-GaN based semiconductor layer, an active layer having multiple quantum wells, and an n-GaN based semiconductor layer; a p-electrode and an n-electrode electrically connecting with the light emitting structure, respectively, wherein the n-electrode has a plurality of layers; a first passivation layer including a first portion contacting a portion of the n-electrode, a second portion vertically overlapped with the p-electrode, and a third portion that extends outside of outermost side surfaces of the light emitting structure; a phosphor layer disposed on a top surface of the light emitting structure; and a second passivation layer including a first portion disposed between the phosphor layer and the top surface of the light emitting structure, and a second portion disposed on the outermost side surfaces of the light emitting structure, in which the phosphor layer includes a pattern to bond a wire with a p-pad on a portion of the p-electrode, the second portion of the second passivation layer extends toward the third portion of the first passivation and contacts the third portion of the first passivation layer, and the first passivation layer includes an opening on the n-GaN based semiconductor layer such that the opening accommodates at least a portion of the n-electrode.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJALycjMU0jLzMlVyMlMzyhRSM3NLCnJzEtXSMnMT0nlYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxocGGBhZGppZmRk5GxsSoAQDjOCR0</recordid><startdate>20201103</startdate><enddate>20201103</enddate><creator>Yoo, Myung Cheol</creator><scope>EVB</scope></search><sort><creationdate>20201103</creationdate><title>Thin film light emitting diode</title><author>Yoo, Myung Cheol</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10825962B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Yoo, Myung Cheol</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Yoo, Myung Cheol</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Thin film light emitting diode</title><date>2020-11-03</date><risdate>2020</risdate><abstract>A light emitting device can include a light emitting structure including a p-GaN based semiconductor layer, an active layer having multiple quantum wells, and an n-GaN based semiconductor layer; a p-electrode and an n-electrode electrically connecting with the light emitting structure, respectively, wherein the n-electrode has a plurality of layers; a first passivation layer including a first portion contacting a portion of the n-electrode, a second portion vertically overlapped with the p-electrode, and a third portion that extends outside of outermost side surfaces of the light emitting structure; a phosphor layer disposed on a top surface of the light emitting structure; and a second passivation layer including a first portion disposed between the phosphor layer and the top surface of the light emitting structure, and a second portion disposed on the outermost side surfaces of the light emitting structure, in which the phosphor layer includes a pattern to bond a wire with a p-pad on a portion of the p-electrode, the second portion of the second passivation layer extends toward the third portion of the first passivation and contacts the third portion of the first passivation layer, and the first passivation layer includes an opening on the n-GaN based semiconductor layer such that the opening accommodates at least a portion of the n-electrode.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Thin film light emitting diode |
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