Resin composition and resin molded body

Provided is a resin composition containing: a cellulose acetate in which the weight average polymerization degree is 120-330 and the degree of substitution of an acetyl group is 2.10-2.60; a (meth)acrylic polymer having a weight average molecular weight of 1000-30000; and a plasticizer.

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Bibliographische Detailangaben
Hauptverfasser:	Moriyama, Masahiro, Yao, Kenji
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
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Beschreibung
Zusammenfassung:	Provided is a resin composition containing: a cellulose acetate in which the weight average polymerization degree is 120-330 and the degree of substitution of an acetyl group is 2.10-2.60; a (meth)acrylic polymer having a weight average molecular weight of 1000-30000; and a plasticizer.