Multi-layered nano-fibrous CMP pads

The present disclosure relates generally to a polishing article, and apparatus and methods of chemical mechanical polishing substrates using the polishing article. In some embodiments, the polishing article, such as a polishing pad, includes multiple layers in which one or more layers (i.e., at leas...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Bajaj, Rajeev, Redeker, Fred C, Orilall, Mahendra C, Tolles, Robert D
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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