Systems and methods for implementing intelligent cooling interface archiectures for cooling systems
Systems and methods are provided to implement intelligent cooling interface architectures for cooling systems that employ a heat transfer interface between multiple separate coolant circulation loops. A heat transfer interface may be advantageously managed based on monitored real time operational pa...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | Weber, Richard M |
description | Systems and methods are provided to implement intelligent cooling interface architectures for cooling systems that employ a heat transfer interface between multiple separate coolant circulation loops. A heat transfer interface may be advantageously managed based on monitored real time operational parameters (e.g., operating conditions such as pressures, mass flow rates, temperatures, etc.) within one or more of the separate coolant loops. Diagnostics and prognostics may be performed to verify proper cooling system operation and to detect out-of-specification operational parameters based on expected or acceptable levels for these measurements in view of the heat load to be removed. In this way, the cooling system performance may be monitored to ensure proper operation and to anticipate and alert a user when cooling system operation is trending toward a failure condition. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10798851B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10798851B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10798851B13</originalsourceid><addsrcrecordid>eNqNjLsKwkAURNNYiPoP1w8QXESMraLYR-uwbGaThX2x91r49wZieqthhjNnWZnmw4LApGNHATKkjsmmQi5kj4AoLvbkosB714-VTEp-3orVBqSLGRyMvAum74zw5F5XC6s9Y_PLVbW9357Xxw45teA8OiKkfTVqfzrX9VFd1OEf5gs6uz_g</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Systems and methods for implementing intelligent cooling interface archiectures for cooling systems</title><source>esp@cenet</source><creator>Weber, Richard M</creator><creatorcontrib>Weber, Richard M</creatorcontrib><description>Systems and methods are provided to implement intelligent cooling interface architectures for cooling systems that employ a heat transfer interface between multiple separate coolant circulation loops. A heat transfer interface may be advantageously managed based on monitored real time operational parameters (e.g., operating conditions such as pressures, mass flow rates, temperatures, etc.) within one or more of the separate coolant loops. Diagnostics and prognostics may be performed to verify proper cooling system operation and to detect out-of-specification operational parameters based on expected or acceptable levels for these measurements in view of the heat load to be removed. In this way, the cooling system performance may be monitored to ensure proper operation and to anticipate and alert a user when cooling system operation is trending toward a failure condition.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COMBINED HEATING AND REFRIGERATION SYSTEMS ; DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEAT EXCHANGE IN GENERAL ; HEAT PUMP SYSTEMS ; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT ; HEATING ; LIGHTING ; LIQUEFACTION SOLIDIFICATION OF GASES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MANUFACTURE OR STORAGE OF ICE ; MECHANICAL ENGINEERING ; PRINTED CIRCUITS ; REFRIGERATION MACHINES, PLANTS OR SYSTEMS ; REFRIGERATION OR COOLING ; SEMICONDUCTOR DEVICES ; WEAPONS</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201006&DB=EPODOC&CC=US&NR=10798851B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201006&DB=EPODOC&CC=US&NR=10798851B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Weber, Richard M</creatorcontrib><title>Systems and methods for implementing intelligent cooling interface archiectures for cooling systems</title><description>Systems and methods are provided to implement intelligent cooling interface architectures for cooling systems that employ a heat transfer interface between multiple separate coolant circulation loops. A heat transfer interface may be advantageously managed based on monitored real time operational parameters (e.g., operating conditions such as pressures, mass flow rates, temperatures, etc.) within one or more of the separate coolant loops. Diagnostics and prognostics may be performed to verify proper cooling system operation and to detect out-of-specification operational parameters based on expected or acceptable levels for these measurements in view of the heat load to be removed. In this way, the cooling system performance may be monitored to ensure proper operation and to anticipate and alert a user when cooling system operation is trending toward a failure condition.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>COMBINED HEATING AND REFRIGERATION SYSTEMS</subject><subject>DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEAT EXCHANGE IN GENERAL</subject><subject>HEAT PUMP SYSTEMS</subject><subject>HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>LIQUEFACTION SOLIDIFICATION OF GASES</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MANUFACTURE OR STORAGE OF ICE</subject><subject>MECHANICAL ENGINEERING</subject><subject>PRINTED CIRCUITS</subject><subject>REFRIGERATION MACHINES, PLANTS OR SYSTEMS</subject><subject>REFRIGERATION OR COOLING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjLsKwkAURNNYiPoP1w8QXESMraLYR-uwbGaThX2x91r49wZieqthhjNnWZnmw4LApGNHATKkjsmmQi5kj4AoLvbkosB714-VTEp-3orVBqSLGRyMvAum74zw5F5XC6s9Y_PLVbW9357Xxw45teA8OiKkfTVqfzrX9VFd1OEf5gs6uz_g</recordid><startdate>20201006</startdate><enddate>20201006</enddate><creator>Weber, Richard M</creator><scope>EVB</scope></search><sort><creationdate>20201006</creationdate><title>Systems and methods for implementing intelligent cooling interface archiectures for cooling systems</title><author>Weber, Richard M</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10798851B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COMBINED HEATING AND REFRIGERATION SYSTEMS</topic><topic>DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEAT EXCHANGE IN GENERAL</topic><topic>HEAT PUMP SYSTEMS</topic><topic>HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>LIQUEFACTION SOLIDIFICATION OF GASES</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MANUFACTURE OR STORAGE OF ICE</topic><topic>MECHANICAL ENGINEERING</topic><topic>PRINTED CIRCUITS</topic><topic>REFRIGERATION MACHINES, PLANTS OR SYSTEMS</topic><topic>REFRIGERATION OR COOLING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>Weber, Richard M</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Weber, Richard M</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Systems and methods for implementing intelligent cooling interface archiectures for cooling systems</title><date>2020-10-06</date><risdate>2020</risdate><abstract>Systems and methods are provided to implement intelligent cooling interface architectures for cooling systems that employ a heat transfer interface between multiple separate coolant circulation loops. A heat transfer interface may be advantageously managed based on monitored real time operational parameters (e.g., operating conditions such as pressures, mass flow rates, temperatures, etc.) within one or more of the separate coolant loops. Diagnostics and prognostics may be performed to verify proper cooling system operation and to detect out-of-specification operational parameters based on expected or acceptable levels for these measurements in view of the heat load to be removed. In this way, the cooling system performance may be monitored to ensure proper operation and to anticipate and alert a user when cooling system operation is trending toward a failure condition.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_epo_espacenet_US10798851B1 |
source | esp@cenet |
subjects | BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMBINED HEATING AND REFRIGERATION SYSTEMS DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT PUMP SYSTEMS HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING LIQUEFACTION SOLIDIFICATION OF GASES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MANUFACTURE OR STORAGE OF ICE MECHANICAL ENGINEERING PRINTED CIRCUITS REFRIGERATION MACHINES, PLANTS OR SYSTEMS REFRIGERATION OR COOLING SEMICONDUCTOR DEVICES WEAPONS |
title | Systems and methods for implementing intelligent cooling interface archiectures for cooling systems |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-27T23%3A07%3A26IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Weber,%20Richard%20M&rft.date=2020-10-06&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS10798851B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |