Wafer level package structure and wafer level packaging method

Wafer level package structures and packaging methods are provided. An exemplary method includes providing a device wafer having a first front surface and a first back surface opposing the first front surface, wherein at least one first chip is integrated in the first front surface; forming a first o...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Luo, Hailong, Drowley, Clifford Ian
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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