Bonded semiconductor structures having bonding contacts made of indiffusible conductive materials and methods for forming the same

Embodiments of bonded semiconductor structures and fabrication methods thereof are disclosed. In an example, a semiconductor device includes a first semiconductor structure, a second semiconductor structure, and a bonding interface between the first semiconductor structure and the second semiconduct...

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Bibliographische Detailangaben

Hauptverfasser:	Liu, Jun, Hua, Zi Qun, Huo, Zongliang, Zhu, Jifeng, Chen, Jun, Xiao, Li Hong
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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