Polyimide precursor and polyimide
A polyimide precursor including at least one repeating unit represented by the following chemical formula (1): in which A is an arylene group; and X1 and X2 are each independently hydrogen, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms, and a polyimide...
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| creator | Oka, Takuya Hisano, Nobuharu Watanabe, Yoshiyuki Kohama, Yukinori |
| description | A polyimide precursor including at least one repeating unit represented by the following chemical formula (1): in which A is an arylene group; and X1 and X2 are each independently hydrogen, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms, and a polyimide obtained from the polyimide precursor has a coefficient of linear thermal expansion from 50° C. to 400° C. of 100 ppm/K or less. |
| format | Patent |
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and X1 and X2 are each independently hydrogen, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms, and a polyimide obtained from the polyimide precursor has a coefficient of linear thermal expansion from 50° C. to 400° C. of 100 ppm/K or less.</description><language>eng</language><subject>ACYCLIC OR CARBOCYCLIC COMPOUNDS ; ADHESIVES ; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COMPOSITIONS BASED THEREON ; CORRECTING FLUIDS ; DYES ; FILLING PASTES ; GENERAL PROCESSES OF COMPOUNDING ; HETEROCYCLIC COMPOUNDS ; INKS ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC CHEMISTRY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; 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and X1 and X2 are each independently hydrogen, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms, and a polyimide obtained from the polyimide precursor has a coefficient of linear thermal expansion from 50° C. to 400° C. of 100 ppm/K or less.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ACYCLIC OR CARBOCYCLIC COMPOUNDS ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES FILLING PASTES GENERAL PROCESSES OF COMPOUNDING HETEROCYCLIC COMPOUNDS INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC CHEMISTRY ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS WORKING-UP |
| title | Polyimide precursor and polyimide |
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