Solid insulation material
Various embodiments may include a solid insulation material, e.g. in tape form, the use thereof in a vacuum impregnation process, and/or an insulation system produced therewith and also an electrical machine having the insulation system, for the medium- and high-voltage sector. Some examples include...
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creator | Schirm, Dieter Huber, Jürgen Übler, Matthias |
description | Various embodiments may include a solid insulation material, e.g. in tape form, the use thereof in a vacuum impregnation process, and/or an insulation system produced therewith and also an electrical machine having the insulation system, for the medium- and high-voltage sector. Some examples include rotating electrical machines in the medium- and high-voltage sector and also semifinished products for electrical switchgear. The solid insulation material and the insulation system produced therewith are characterized in that it can be produced in an anhydride-free manner, wherein the curing catalyst is, for example, an adduct of a 1H-imidazole and/or 1H-imidazole derivative with a compound containing oxirane groups. |
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Some examples include rotating electrical machines in the medium- and high-voltage sector and also semifinished products for electrical switchgear. The solid insulation material and the insulation system produced therewith are characterized in that it can be produced in an anhydride-free manner, wherein the curing catalyst is, for example, an adduct of a 1H-imidazole and/or 1H-imidazole derivative with a compound containing oxirane groups.</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CABLES ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; CONDUCTORS ; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ; DYES ; DYNAMO-ELECTRIC MACHINES ; ELECTRICITY ; GENERATION ; INSULATORS ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PERFORMING OPERATIONS ; POLISHES ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200915&DB=EPODOC&CC=US&NR=10778058B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200915&DB=EPODOC&CC=US&NR=10778058B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Schirm, Dieter</creatorcontrib><creatorcontrib>Huber, Jürgen</creatorcontrib><creatorcontrib>Übler, Matthias</creatorcontrib><title>Solid insulation material</title><description>Various embodiments may include a solid insulation material, e.g. in tape form, the use thereof in a vacuum impregnation process, and/or an insulation system produced therewith and also an electrical machine having the insulation system, for the medium- and high-voltage sector. Some examples include rotating electrical machines in the medium- and high-voltage sector and also semifinished products for electrical switchgear. The solid insulation material and the insulation system produced therewith are characterized in that it can be produced in an anhydride-free manner, wherein the curing catalyst is, for example, an adduct of a 1H-imidazole and/or 1H-imidazole derivative with a compound containing oxirane groups.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>CONDUCTORS</subject><subject>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</subject><subject>DYES</subject><subject>DYNAMO-ELECTRIC MACHINES</subject><subject>ELECTRICITY</subject><subject>GENERATION</subject><subject>INSULATORS</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHES</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAMzs_JTFHIzCsuzUksyczPU8hNLEktykzM4WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8aHBhgbm5hYGphZORsbEqAEAN3EjDA</recordid><startdate>20200915</startdate><enddate>20200915</enddate><creator>Schirm, Dieter</creator><creator>Huber, Jürgen</creator><creator>Übler, Matthias</creator><scope>EVB</scope></search><sort><creationdate>20200915</creationdate><title>Solid insulation material</title><author>Schirm, Dieter ; Huber, Jürgen ; Übler, Matthias</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10778058B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2020</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>CONDUCTORS</topic><topic>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</topic><topic>DYES</topic><topic>DYNAMO-ELECTRIC MACHINES</topic><topic>ELECTRICITY</topic><topic>GENERATION</topic><topic>INSULATORS</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHES</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>Schirm, Dieter</creatorcontrib><creatorcontrib>Huber, Jürgen</creatorcontrib><creatorcontrib>Übler, Matthias</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Schirm, Dieter</au><au>Huber, Jürgen</au><au>Übler, Matthias</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Solid insulation material</title><date>2020-09-15</date><risdate>2020</risdate><abstract>Various embodiments may include a solid insulation material, e.g. in tape form, the use thereof in a vacuum impregnation process, and/or an insulation system produced therewith and also an electrical machine having the insulation system, for the medium- and high-voltage sector. Some examples include rotating electrical machines in the medium- and high-voltage sector and also semifinished products for electrical switchgear. The solid insulation material and the insulation system produced therewith are characterized in that it can be produced in an anhydride-free manner, wherein the curing catalyst is, for example, an adduct of a 1H-imidazole and/or 1H-imidazole derivative with a compound containing oxirane groups.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON CONDUCTORS CONVERSION OR DISTRIBUTION OF ELECTRIC POWER DYES DYNAMO-ELECTRIC MACHINES ELECTRICITY GENERATION INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES |
title | Solid insulation material |
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