Board-to-board contactless connectors and methods for the assembly thereof
The present disclosure relates to extremely high frequency ("EHF") systems and methods for the use thereof, and more particularly to board-to-board connections using contactless connectors.
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| creator | Isaac, Roger D Abdulla, Mostafa Naguib |
| description | The present disclosure relates to extremely high frequency ("EHF") systems and methods for the use thereof, and more particularly to board-to-board connections using contactless connectors. |
| format | Patent |
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| subjects | BASIC ELECTRIC ELEMENTS CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTINGELECTRIC POWER COMPUTING CONVERSION OR DISTRIBUTION OF ELECTRIC POWER COUNTING ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION INDUCTANCES MAGNETS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES SEMICONDUCTOR DEVICES SYSTEMS FOR STORING ELECTRIC ENERGY TRANSFORMERS TRANSMISSION WAVEGUIDES |
| title | Board-to-board contactless connectors and methods for the assembly thereof |
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