Gradient micro-electro-mechanical systems (MEMS) microphone
In at least one embodiment, a micro-electro-mechanical systems (MEMS) microphone assembly is provided. The assembly includes an enclosure, a MEMS transducer, and a plurality of substrate layers. The single MEMS transducer is positioned within the enclosure. The plurality of substrate layers support...
Gespeichert in:
Hauptverfasser: | , , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | Reese, Marc Li, Fengyuan Michel, Alan D Marcus, Larry A Baumhauer, Jr., John C |
description | In at least one embodiment, a micro-electro-mechanical systems (MEMS) microphone assembly is provided. The assembly includes an enclosure, a MEMS transducer, and a plurality of substrate layers. The single MEMS transducer is positioned within the enclosure. The plurality of substrate layers support the single MEMS transducer. The plurality of substrate layers define a first transmission mechanism to enable a first side of the single MEMS transducer to receive an audio input signal and a second transmission mechanism to enable a second side of the single MEMS transducer to receive the audio input signal. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10771875B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10771875B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10771875B23</originalsourceid><addsrcrecordid>eNrjZLB2L0pMyUzNK1HIzUwuytdNzUlNLgHSuanJGYl5mcmJOQrFlcUlqbnFChq-rr7BmhB1BRn5eak8DKxpiTnFqbxQmptB0c01xNlDN7UgPz61uCAxOTUvtSQ-NNjQwNzc0MLc1MnImBg1AJEOL0I</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Gradient micro-electro-mechanical systems (MEMS) microphone</title><source>esp@cenet</source><creator>Reese, Marc ; Li, Fengyuan ; Michel, Alan D ; Marcus, Larry A ; Baumhauer, Jr., John C</creator><creatorcontrib>Reese, Marc ; Li, Fengyuan ; Michel, Alan D ; Marcus, Larry A ; Baumhauer, Jr., John C</creatorcontrib><description>In at least one embodiment, a micro-electro-mechanical systems (MEMS) microphone assembly is provided. The assembly includes an enclosure, a MEMS transducer, and a plurality of substrate layers. The single MEMS transducer is positioned within the enclosure. The plurality of substrate layers support the single MEMS transducer. The plurality of substrate layers define a first transmission mechanism to enable a first side of the single MEMS transducer to receive an audio input signal and a second transmission mechanism to enable a second side of the single MEMS transducer to receive the audio input signal.</description><language>eng</language><subject>DEAF-AID SETS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRICITY ; LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS ; PUBLIC ADDRESS SYSTEMS</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200908&DB=EPODOC&CC=US&NR=10771875B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200908&DB=EPODOC&CC=US&NR=10771875B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Reese, Marc</creatorcontrib><creatorcontrib>Li, Fengyuan</creatorcontrib><creatorcontrib>Michel, Alan D</creatorcontrib><creatorcontrib>Marcus, Larry A</creatorcontrib><creatorcontrib>Baumhauer, Jr., John C</creatorcontrib><title>Gradient micro-electro-mechanical systems (MEMS) microphone</title><description>In at least one embodiment, a micro-electro-mechanical systems (MEMS) microphone assembly is provided. The assembly includes an enclosure, a MEMS transducer, and a plurality of substrate layers. The single MEMS transducer is positioned within the enclosure. The plurality of substrate layers support the single MEMS transducer. The plurality of substrate layers define a first transmission mechanism to enable a first side of the single MEMS transducer to receive an audio input signal and a second transmission mechanism to enable a second side of the single MEMS transducer to receive the audio input signal.</description><subject>DEAF-AID SETS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRICITY</subject><subject>LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS</subject><subject>PUBLIC ADDRESS SYSTEMS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLB2L0pMyUzNK1HIzUwuytdNzUlNLgHSuanJGYl5mcmJOQrFlcUlqbnFChq-rr7BmhB1BRn5eak8DKxpiTnFqbxQmptB0c01xNlDN7UgPz61uCAxOTUvtSQ-NNjQwNzc0MLc1MnImBg1AJEOL0I</recordid><startdate>20200908</startdate><enddate>20200908</enddate><creator>Reese, Marc</creator><creator>Li, Fengyuan</creator><creator>Michel, Alan D</creator><creator>Marcus, Larry A</creator><creator>Baumhauer, Jr., John C</creator><scope>EVB</scope></search><sort><creationdate>20200908</creationdate><title>Gradient micro-electro-mechanical systems (MEMS) microphone</title><author>Reese, Marc ; Li, Fengyuan ; Michel, Alan D ; Marcus, Larry A ; Baumhauer, Jr., John C</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10771875B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2020</creationdate><topic>DEAF-AID SETS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRICITY</topic><topic>LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS</topic><topic>PUBLIC ADDRESS SYSTEMS</topic><toplevel>online_resources</toplevel><creatorcontrib>Reese, Marc</creatorcontrib><creatorcontrib>Li, Fengyuan</creatorcontrib><creatorcontrib>Michel, Alan D</creatorcontrib><creatorcontrib>Marcus, Larry A</creatorcontrib><creatorcontrib>Baumhauer, Jr., John C</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Reese, Marc</au><au>Li, Fengyuan</au><au>Michel, Alan D</au><au>Marcus, Larry A</au><au>Baumhauer, Jr., John C</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Gradient micro-electro-mechanical systems (MEMS) microphone</title><date>2020-09-08</date><risdate>2020</risdate><abstract>In at least one embodiment, a micro-electro-mechanical systems (MEMS) microphone assembly is provided. The assembly includes an enclosure, a MEMS transducer, and a plurality of substrate layers. The single MEMS transducer is positioned within the enclosure. The plurality of substrate layers support the single MEMS transducer. The plurality of substrate layers define a first transmission mechanism to enable a first side of the single MEMS transducer to receive an audio input signal and a second transmission mechanism to enable a second side of the single MEMS transducer to receive the audio input signal.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_epo_espacenet_US10771875B2 |
source | esp@cenet |
subjects | DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS PUBLIC ADDRESS SYSTEMS |
title | Gradient micro-electro-mechanical systems (MEMS) microphone |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-19T19%3A35%3A54IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Reese,%20Marc&rft.date=2020-09-08&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS10771875B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |