Deposition methodology for superconductor interconnects

A method of forming a superconductor interconnect structure is disclosed. The method includes forming a dielectric layer overlying a substrate, forming an interconnect opening in the dielectric layer, and moving the substrate to a deposition chamber. The method further includes depositing a supercon...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Rennie, Michael, Kirby, Christopher F, Luu, Vivien M, McLaughlin, Sean R
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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