Wafer flatness control using backside compensation structure

Embodiments of semiconductor structures for wafer flatness control and methods for using and forming the same are disclosed. In an example, a model indicative of a flatness difference of a wafer between a first direction and a second direction is obtained. The flatness difference is associated with...

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Bibliographische Detailangaben

Hauptverfasser:	He, Jialan, Tao, Qian, Lu, Zhenyu, Li, Zhaosong, Hu, Yushi, Xia, Ji, Dai, Xiaowang
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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