Laser cutting apparatus and laser cutting method using the same

A laser cutting apparatus and a laser cutting method are provided. A laser cutting method includes: preparing an object on a stage; cutting the object into a set shape by relatively moving and irradiating a laser beam along the set shape with respect to the object; and performing uniform heating com...

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Bibliographische Detailangaben
Hauptverfasser:	Han, Gyoowan, Kang, Kuhyun, Kim, Jaeil, Park, Soobum, Jeong, Ilyoung
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING GLASS MACHINE TOOLS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A laser cutting apparatus and a laser cutting method are provided. A laser cutting method includes: preparing an object on a stage; cutting the object into a set shape by relatively moving and irradiating a laser beam along the set shape with respect to the object; and performing uniform heating compensation to reduce accumulation of thermal energy of the laser beam resulting from a change of speed at a shift point where a travelling direction of the laser beam with respect to the object changes.