Conductive agent and module bonding method

The present disclosure provides a conductive agent and a module bonding method. In the method, a conductive agent is sprayed to a bonding region. The conductive agent comprising a liquid ultraviolet curable adhesive and conductive particles dispersed in the ultraviolet curable adhesive. A module lay...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Xu, Jian, Mao, Qining, Huang, Changqing, Niu, Pengcheng, Liu, Peng, Xu, Chao, Wang, Yang, Hou, Zhanghai
Format: Patent
Sprache:eng
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