Memory device including bump arrays spaced apart from each other and electronic device including the same

A memory device includes a buffer die including a first bump array and a second bump array spaced apart from each other in a first direction parallel to a lower surface of the buffer die; a first memory die stacked on the buffer die through a plurality of first through silicon vias and including ban...

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Bibliographische Detailangaben

Hauptverfasser:	Choo, Chul-Hwan, Song, Woong-Jae
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INFORMATION STORAGE PHYSICS SEMICONDUCTOR DEVICES STATIC STORES
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