Method of transferring thin film

The present invention discloses a method for transferring a thin film from a first substrate to a second substrate comprising the steps of: providing a transfer structure and a thin film provided on a surface of a first substrate, the transfer structure comprising a support layer and a film contact...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Chua, Lay-Lay, Lim, Geok Kieng, Kam, Fong Yu, Zhuo, Jing-Mei, Song, Jie, Wong, Loke-Yuen, Loh, Kian Ping, Ho, Peter, Png, Rui-Qi
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BORING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING TURNING
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