Semiconductor device package having a mounting plate with protrusions exposed from a resin material

According to one embodiment, a semiconductor device of an embodiment includes a substrate, a metal plate having a main portion having a first width in a first direction and a second width in a second direction orthogonal to the first direction, a first semiconductor chip located between the metal pl...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Aoki, Hideo, Goto, Yoshiaki, Tsukiyama, Satoshi
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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