Substrate treating apparatus and substrate treating method

Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating apparatus including a spin head configured to support the substrate, a nozzle configured to discharge a chemical to the substrate located on the spin head, a first passage configured to supply a firs...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Kim, Heehwan, Lee, Sul
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!