Thermoplastic resin composition and molded article produced therefrom
A thermoplastic resin composition of the present invention comprises: (A) about 20 to about 70% by weight of an aromatic polyamide resin comprising at least two aromatic dicarboxylic acid units; (B) about 0.1 to about 20% by weight of an olefin-based copolymer; and (C) about 10% to about 60% by weig...
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creator | Hong, Sang Hyun Kang, Hyoung Taek Shin, Chan Gyun Kim, Ik Mo Kim, Kyung Rae |
description | A thermoplastic resin composition of the present invention comprises: (A) about 20 to about 70% by weight of an aromatic polyamide resin comprising at least two aromatic dicarboxylic acid units; (B) about 0.1 to about 20% by weight of an olefin-based copolymer; and (C) about 10% to about 60% by weight of an inorganic filler. The thermoplastic resin composition and a molded article produced therefrom are excellent in plateability, impact resistance, heat resistance and the like. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10703904B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10703904B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10703904B23</originalsourceid><addsrcrecordid>eNqNi0EKwjAQAHPxINU_rA8QohWkV6XFu_VcQrLFQJJdduP_zcEHeBoYZrZmnN8omTg5rdGDoMYCnjKTxhqpgCsBMqWAAZy0JCGwUPj4Jmp7cRXKO7NZXVLc_9iZwzTO98cRmRZUdh4L1uX1PNmr7Qd7uZ37f5ovVzs0Eg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Thermoplastic resin composition and molded article produced therefrom</title><source>esp@cenet</source><creator>Hong, Sang Hyun ; Kang, Hyoung Taek ; Shin, Chan Gyun ; Kim, Ik Mo ; Kim, Kyung Rae</creator><creatorcontrib>Hong, Sang Hyun ; Kang, Hyoung Taek ; Shin, Chan Gyun ; Kim, Ik Mo ; Kim, Kyung Rae</creatorcontrib><description>A thermoplastic resin composition of the present invention comprises: (A) about 20 to about 70% by weight of an aromatic polyamide resin comprising at least two aromatic dicarboxylic acid units; (B) about 0.1 to about 20% by weight of an olefin-based copolymer; and (C) about 10% to about 60% by weight of an inorganic filler. The thermoplastic resin composition and a molded article produced therefrom are excellent in plateability, impact resistance, heat resistance and the like.</description><language>eng</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; GENERAL PROCESSES OF COMPOUNDING ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; WORKING-UP</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200707&DB=EPODOC&CC=US&NR=10703904B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200707&DB=EPODOC&CC=US&NR=10703904B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Hong, Sang Hyun</creatorcontrib><creatorcontrib>Kang, Hyoung Taek</creatorcontrib><creatorcontrib>Shin, Chan Gyun</creatorcontrib><creatorcontrib>Kim, Ik Mo</creatorcontrib><creatorcontrib>Kim, Kyung Rae</creatorcontrib><title>Thermoplastic resin composition and molded article produced therefrom</title><description>A thermoplastic resin composition of the present invention comprises: (A) about 20 to about 70% by weight of an aromatic polyamide resin comprising at least two aromatic dicarboxylic acid units; (B) about 0.1 to about 20% by weight of an olefin-based copolymer; and (C) about 10% to about 60% by weight of an inorganic filler. The thermoplastic resin composition and a molded article produced therefrom are excellent in plateability, impact resistance, heat resistance and the like.</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNi0EKwjAQAHPxINU_rA8QohWkV6XFu_VcQrLFQJJdduP_zcEHeBoYZrZmnN8omTg5rdGDoMYCnjKTxhqpgCsBMqWAAZy0JCGwUPj4Jmp7cRXKO7NZXVLc_9iZwzTO98cRmRZUdh4L1uX1PNmr7Qd7uZ37f5ovVzs0Eg</recordid><startdate>20200707</startdate><enddate>20200707</enddate><creator>Hong, Sang Hyun</creator><creator>Kang, Hyoung Taek</creator><creator>Shin, Chan Gyun</creator><creator>Kim, Ik Mo</creator><creator>Kim, Kyung Rae</creator><scope>EVB</scope></search><sort><creationdate>20200707</creationdate><title>Thermoplastic resin composition and molded article produced therefrom</title><author>Hong, Sang Hyun ; Kang, Hyoung Taek ; Shin, Chan Gyun ; Kim, Ik Mo ; Kim, Kyung Rae</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10703904B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2020</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>Hong, Sang Hyun</creatorcontrib><creatorcontrib>Kang, Hyoung Taek</creatorcontrib><creatorcontrib>Shin, Chan Gyun</creatorcontrib><creatorcontrib>Kim, Ik Mo</creatorcontrib><creatorcontrib>Kim, Kyung Rae</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Hong, Sang Hyun</au><au>Kang, Hyoung Taek</au><au>Shin, Chan Gyun</au><au>Kim, Ik Mo</au><au>Kim, Kyung Rae</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Thermoplastic resin composition and molded article produced therefrom</title><date>2020-07-07</date><risdate>2020</risdate><abstract>A thermoplastic resin composition of the present invention comprises: (A) about 20 to about 70% by weight of an aromatic polyamide resin comprising at least two aromatic dicarboxylic acid units; (B) about 0.1 to about 20% by weight of an olefin-based copolymer; and (C) about 10% to about 60% by weight of an inorganic filler. The thermoplastic resin composition and a molded article produced therefrom are excellent in plateability, impact resistance, heat resistance and the like.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP |
title | Thermoplastic resin composition and molded article produced therefrom |
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