Optically aligned hybrid semiconductor device and method
Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligne...
Gespeichert in:
Hauptverfasser: | , , , , , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | Nuttall, Nathan A Klein, Holger N Blumenthal, Daniel J Desai, Kishor V Novack, Ari Jason Shi, Ruizhi Kinghorn, David Henry Hochberg, Michael J |
description | Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10678005B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10678005B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10678005B23</originalsourceid><addsrcrecordid>eNrjZLDwLyjJTE7MyalUSMzJTM9LTVHIqEwqykxRKE7NzUzOz0spTS7JL1JISS3LTE5VSMxLUchNLcnIT-FhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfGhwYYGZuYWBgamTkbGxKgBADBlLrM</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Optically aligned hybrid semiconductor device and method</title><source>esp@cenet</source><creator>Nuttall, Nathan A ; Klein, Holger N ; Blumenthal, Daniel J ; Desai, Kishor V ; Novack, Ari Jason ; Shi, Ruizhi ; Kinghorn, David Henry ; Hochberg, Michael J</creator><creatorcontrib>Nuttall, Nathan A ; Klein, Holger N ; Blumenthal, Daniel J ; Desai, Kishor V ; Novack, Ari Jason ; Shi, Ruizhi ; Kinghorn, David Henry ; Hochberg, Michael J</creatorcontrib><description>Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PHYSICS ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200609&DB=EPODOC&CC=US&NR=10678005B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200609&DB=EPODOC&CC=US&NR=10678005B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Nuttall, Nathan A</creatorcontrib><creatorcontrib>Klein, Holger N</creatorcontrib><creatorcontrib>Blumenthal, Daniel J</creatorcontrib><creatorcontrib>Desai, Kishor V</creatorcontrib><creatorcontrib>Novack, Ari Jason</creatorcontrib><creatorcontrib>Shi, Ruizhi</creatorcontrib><creatorcontrib>Kinghorn, David Henry</creatorcontrib><creatorcontrib>Hochberg, Michael J</creatorcontrib><title>Optically aligned hybrid semiconductor device and method</title><description>Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDwLyjJTE7MyalUSMzJTM9LTVHIqEwqykxRKE7NzUzOz0spTS7JL1JISS3LTE5VSMxLUchNLcnIT-FhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfGhwYYGZuYWBgamTkbGxKgBADBlLrM</recordid><startdate>20200609</startdate><enddate>20200609</enddate><creator>Nuttall, Nathan A</creator><creator>Klein, Holger N</creator><creator>Blumenthal, Daniel J</creator><creator>Desai, Kishor V</creator><creator>Novack, Ari Jason</creator><creator>Shi, Ruizhi</creator><creator>Kinghorn, David Henry</creator><creator>Hochberg, Michael J</creator><scope>EVB</scope></search><sort><creationdate>20200609</creationdate><title>Optically aligned hybrid semiconductor device and method</title><author>Nuttall, Nathan A ; Klein, Holger N ; Blumenthal, Daniel J ; Desai, Kishor V ; Novack, Ari Jason ; Shi, Ruizhi ; Kinghorn, David Henry ; Hochberg, Michael J</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10678005B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Nuttall, Nathan A</creatorcontrib><creatorcontrib>Klein, Holger N</creatorcontrib><creatorcontrib>Blumenthal, Daniel J</creatorcontrib><creatorcontrib>Desai, Kishor V</creatorcontrib><creatorcontrib>Novack, Ari Jason</creatorcontrib><creatorcontrib>Shi, Ruizhi</creatorcontrib><creatorcontrib>Kinghorn, David Henry</creatorcontrib><creatorcontrib>Hochberg, Michael J</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Nuttall, Nathan A</au><au>Klein, Holger N</au><au>Blumenthal, Daniel J</au><au>Desai, Kishor V</au><au>Novack, Ari Jason</au><au>Shi, Ruizhi</au><au>Kinghorn, David Henry</au><au>Hochberg, Michael J</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Optically aligned hybrid semiconductor device and method</title><date>2020-06-09</date><risdate>2020</risdate><abstract>Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_epo_espacenet_US10678005B2 |
source | esp@cenet |
subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS SEMICONDUCTOR DEVICES |
title | Optically aligned hybrid semiconductor device and method |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-19T23%3A11%3A30IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Nuttall,%20Nathan%20A&rft.date=2020-06-09&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS10678005B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |