Thin profile power semiconductor device package having face-to-face mounted dice and no internal bondwires

Thin profile power semiconductor device package having face-to-face mounted dice and no internal bondwires

A packaged semiconductor device has a thin profile, two face-to-face mounted power semiconductor device dice, and no internal bond wires. A first semiconductor device die is mounted so that a gate pad is bonded to the bottom of a first lead, and so that a source pad is bonded to the bottom of a seco...

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1. Verfasser: Zommer, Nathan
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Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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description A packaged semiconductor device has a thin profile, two face-to-face mounted power semiconductor device dice, and no internal bond wires. A first semiconductor device die is mounted so that a gate pad is bonded to the bottom of a first lead, and so that a source pad is bonded to the bottom of a second lead. A second semiconductor device die identical to the first is mounted so that a gate pad is bonded to the top of the first lead, and so that a source pad is bonded to the top of the second lead. The backside drain electrodes of both dice are electrically coupled to a third lead. The third lead in one example has a forked-shape, and the two dice are disposed entirely between the two tines of the fork. After encapsulation, the three leads extend parallel to each other from a body portion of the package.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Thin profile power semiconductor device package having face-to-face mounted dice and no internal bondwires
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