Integrated electro-optical module assembly
An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component...
Gespeichert in:
Hauptverfasser: | , , , , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | Dang, Bing Polastre, Robert J Knickerbocker, John U Chen, Qianwen Webb, Bucknell C Andry, Paul S Lu, Minhua |
description | An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10670656B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10670656B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10670656B23</originalsourceid><addsrcrecordid>eNrjZNDyzCtJTS9KLElNUUjNSU0uKcrXzS8oyUxOzFHIzU8pzUlVSCwuTs1NyqnkYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxocGGBmbmBmamZk5GxsSoAQBeISmX</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Integrated electro-optical module assembly</title><source>esp@cenet</source><creator>Dang, Bing ; Polastre, Robert J ; Knickerbocker, John U ; Chen, Qianwen ; Webb, Bucknell C ; Andry, Paul S ; Lu, Minhua</creator><creatorcontrib>Dang, Bing ; Polastre, Robert J ; Knickerbocker, John U ; Chen, Qianwen ; Webb, Bucknell C ; Andry, Paul S ; Lu, Minhua</creatorcontrib><description>An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; PRINTED CIRCUITS ; PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY ; TESTING</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200602&DB=EPODOC&CC=US&NR=10670656B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200602&DB=EPODOC&CC=US&NR=10670656B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Dang, Bing</creatorcontrib><creatorcontrib>Polastre, Robert J</creatorcontrib><creatorcontrib>Knickerbocker, John U</creatorcontrib><creatorcontrib>Chen, Qianwen</creatorcontrib><creatorcontrib>Webb, Bucknell C</creatorcontrib><creatorcontrib>Andry, Paul S</creatorcontrib><creatorcontrib>Lu, Minhua</creatorcontrib><title>Integrated electro-optical module assembly</title><description>An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDyzCtJTS9KLElNUUjNSU0uKcrXzS8oyUxOzFHIzU8pzUlVSCwuTs1NyqnkYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxocGGBmbmBmamZk5GxsSoAQBeISmX</recordid><startdate>20200602</startdate><enddate>20200602</enddate><creator>Dang, Bing</creator><creator>Polastre, Robert J</creator><creator>Knickerbocker, John U</creator><creator>Chen, Qianwen</creator><creator>Webb, Bucknell C</creator><creator>Andry, Paul S</creator><creator>Lu, Minhua</creator><scope>EVB</scope></search><sort><creationdate>20200602</creationdate><title>Integrated electro-optical module assembly</title><author>Dang, Bing ; Polastre, Robert J ; Knickerbocker, John U ; Chen, Qianwen ; Webb, Bucknell C ; Andry, Paul S ; Lu, Minhua</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10670656B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>Dang, Bing</creatorcontrib><creatorcontrib>Polastre, Robert J</creatorcontrib><creatorcontrib>Knickerbocker, John U</creatorcontrib><creatorcontrib>Chen, Qianwen</creatorcontrib><creatorcontrib>Webb, Bucknell C</creatorcontrib><creatorcontrib>Andry, Paul S</creatorcontrib><creatorcontrib>Lu, Minhua</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Dang, Bing</au><au>Polastre, Robert J</au><au>Knickerbocker, John U</au><au>Chen, Qianwen</au><au>Webb, Bucknell C</au><au>Andry, Paul S</au><au>Lu, Minhua</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Integrated electro-optical module assembly</title><date>2020-06-02</date><risdate>2020</risdate><abstract>An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_epo_espacenet_US10670656B2 |
source | esp@cenet |
subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS PRINTED CIRCUITS PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY TESTING |
title | Integrated electro-optical module assembly |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-29T11%3A23%3A48IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Dang,%20Bing&rft.date=2020-06-02&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS10670656B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |