Application specific electronics packaging systems, methods and devices

Depicted embodiments are directed to an Application Specific Electronics Packaging ("ASEP") system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the "batch" processes used to currently manufacture electro...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Spiegel, Marko, Panda, Amrit, Zaderej, Victor
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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