Electronic device and electromagnetic shielding assembly thereof
An electromagnetic shielding assembly configured to be disposed on a circuit board with at least one electronic component includes a plurality of shielding housings. The shielding housings form a gap therebetween. Each of the shielding housings has a first opening adjoining the gap. The shielding ho...
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creator | Tsai, Wen-Cheng Huang, Jr-Hung Huang, Mei-Hsueh |
description | An electromagnetic shielding assembly configured to be disposed on a circuit board with at least one electronic component includes a plurality of shielding housings. The shielding housings form a gap therebetween. Each of the shielding housings has a first opening adjoining the gap. The shielding housings are configured to accommodate part of the electronic component. The electronic component is configured to pass through the first openings of the shielding housings and the gap. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10660246B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10660246B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10660246B13</originalsourceid><addsrcrecordid>eNrjZHBwzUlNLinKz8tMVkhJLctMTlVIzEtRSIWI5iam56WWAKWKMzJTc1Iy89IVEouLU3OTcioVSjJSi1Lz03gYWNMSc4pTeaE0N4Oim2uIs4duakF-fGpxQWJyKtCI-NBgQwMzMwMjEzMnQ2Ni1AAAB1ox8A</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Electronic device and electromagnetic shielding assembly thereof</title><source>esp@cenet</source><creator>Tsai, Wen-Cheng ; Huang, Jr-Hung ; Huang, Mei-Hsueh</creator><creatorcontrib>Tsai, Wen-Cheng ; Huang, Jr-Hung ; Huang, Mei-Hsueh</creatorcontrib><description>An electromagnetic shielding assembly configured to be disposed on a circuit board with at least one electronic component includes a plurality of shielding housings. The shielding housings form a gap therebetween. Each of the shielding housings has a first opening adjoining the gap. The shielding housings are configured to accommodate part of the electronic component. The electronic component is configured to pass through the first openings of the shielding housings and the gap.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200519&DB=EPODOC&CC=US&NR=10660246B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200519&DB=EPODOC&CC=US&NR=10660246B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Tsai, Wen-Cheng</creatorcontrib><creatorcontrib>Huang, Jr-Hung</creatorcontrib><creatorcontrib>Huang, Mei-Hsueh</creatorcontrib><title>Electronic device and electromagnetic shielding assembly thereof</title><description>An electromagnetic shielding assembly configured to be disposed on a circuit board with at least one electronic component includes a plurality of shielding housings. The shielding housings form a gap therebetween. Each of the shielding housings has a first opening adjoining the gap. The shielding housings are configured to accommodate part of the electronic component. The electronic component is configured to pass through the first openings of the shielding housings and the gap.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHBwzUlNLinKz8tMVkhJLctMTlVIzEtRSIWI5iam56WWAKWKMzJTc1Iy89IVEouLU3OTcioVSjJSi1Lz03gYWNMSc4pTeaE0N4Oim2uIs4duakF-fGpxQWJyKtCI-NBgQwMzMwMjEzMnQ2Ni1AAAB1ox8A</recordid><startdate>20200519</startdate><enddate>20200519</enddate><creator>Tsai, Wen-Cheng</creator><creator>Huang, Jr-Hung</creator><creator>Huang, Mei-Hsueh</creator><scope>EVB</scope></search><sort><creationdate>20200519</creationdate><title>Electronic device and electromagnetic shielding assembly thereof</title><author>Tsai, Wen-Cheng ; Huang, Jr-Hung ; Huang, Mei-Hsueh</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10660246B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2020</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>Tsai, Wen-Cheng</creatorcontrib><creatorcontrib>Huang, Jr-Hung</creatorcontrib><creatorcontrib>Huang, Mei-Hsueh</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Tsai, Wen-Cheng</au><au>Huang, Jr-Hung</au><au>Huang, Mei-Hsueh</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electronic device and electromagnetic shielding assembly thereof</title><date>2020-05-19</date><risdate>2020</risdate><abstract>An electromagnetic shielding assembly configured to be disposed on a circuit board with at least one electronic component includes a plurality of shielding housings. The shielding housings form a gap therebetween. Each of the shielding housings has a first opening adjoining the gap. The shielding housings are configured to accommodate part of the electronic component. The electronic component is configured to pass through the first openings of the shielding housings and the gap.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
title | Electronic device and electromagnetic shielding assembly thereof |
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