Formable shielding film
A shielding film comprises multiple layers including one or more of a structured adhesive layer, an electrically conductive layer, an electrically insulative thermally conductive layer, and an electrically conductive adhesive layer. The electrically conductive shielding layer extends laterally beyon...
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| creator | Chiu, Chun-Ming Chen, Wei-Yu Lee, I-Liang |
| description | A shielding film comprises multiple layers including one or more of a structured adhesive layer, an electrically conductive layer, an electrically insulative thermally conductive layer, and an electrically conductive adhesive layer. The electrically conductive shielding layer extends laterally beyond the structured adhesive layer. The electrically insulative thermally conductive layer is disposed between the electrically conductive shielding layer and the structured adhesive layer and is coextensive with the structured adhesive layer. The electrically conductive adhesive layer is disposed between the electrically conductive shielding layer and the thermally conductive layer and is coextensive with the electrically conductive shielding layer. When the multilayer shielding film is placed on an electronic device mounted on a circuit board and under application of one or more of heat, vacuum, and pressure, the multilayer shielding film conforms to the electronic device and the electrically conductive adhesive layer adheres to the circuit board providing a seal between the multilayer shielding film and the circuit board. |
| format | Patent |
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The electrically conductive shielding layer extends laterally beyond the structured adhesive layer. The electrically insulative thermally conductive layer is disposed between the electrically conductive shielding layer and the structured adhesive layer and is coextensive with the structured adhesive layer. The electrically conductive adhesive layer is disposed between the electrically conductive shielding layer and the thermally conductive layer and is coextensive with the electrically conductive shielding layer. When the multilayer shielding film is placed on an electronic device mounted on a circuit board and under application of one or more of heat, vacuum, and pressure, the multilayer shielding film conforms to the electronic device and the electrically conductive adhesive layer adheres to the circuit board providing a seal between the multilayer shielding film and the circuit board.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200512&DB=EPODOC&CC=US&NR=10652996B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200512&DB=EPODOC&CC=US&NR=10652996B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Chiu, Chun-Ming</creatorcontrib><creatorcontrib>Chen, Wei-Yu</creatorcontrib><creatorcontrib>Lee, I-Liang</creatorcontrib><title>Formable shielding film</title><description>A shielding film comprises multiple layers including one or more of a structured adhesive layer, an electrically conductive layer, an electrically insulative thermally conductive layer, and an electrically conductive adhesive layer. The electrically conductive shielding layer extends laterally beyond the structured adhesive layer. The electrically insulative thermally conductive layer is disposed between the electrically conductive shielding layer and the structured adhesive layer and is coextensive with the structured adhesive layer. The electrically conductive adhesive layer is disposed between the electrically conductive shielding layer and the thermally conductive layer and is coextensive with the electrically conductive shielding layer. When the multilayer shielding film is placed on an electronic device mounted on a circuit board and under application of one or more of heat, vacuum, and pressure, the multilayer shielding film conforms to the electronic device and the electrically conductive adhesive layer adheres to the circuit board providing a seal between the multilayer shielding film and the circuit board.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBB3yy_KTUzKSVUozshMzUnJzEtXSMvMyeVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfGhwYYGZqZGlpZmTkbGxKgBAMaNIgU</recordid><startdate>20200512</startdate><enddate>20200512</enddate><creator>Chiu, Chun-Ming</creator><creator>Chen, Wei-Yu</creator><creator>Lee, I-Liang</creator><scope>EVB</scope></search><sort><creationdate>20200512</creationdate><title>Formable shielding film</title><author>Chiu, Chun-Ming ; Chen, Wei-Yu ; Lee, I-Liang</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10652996B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2020</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>Chiu, Chun-Ming</creatorcontrib><creatorcontrib>Chen, Wei-Yu</creatorcontrib><creatorcontrib>Lee, I-Liang</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Chiu, Chun-Ming</au><au>Chen, Wei-Yu</au><au>Lee, I-Liang</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Formable shielding film</title><date>2020-05-12</date><risdate>2020</risdate><abstract>A shielding film comprises multiple layers including one or more of a structured adhesive layer, an electrically conductive layer, an electrically insulative thermally conductive layer, and an electrically conductive adhesive layer. The electrically conductive shielding layer extends laterally beyond the structured adhesive layer. The electrically insulative thermally conductive layer is disposed between the electrically conductive shielding layer and the structured adhesive layer and is coextensive with the structured adhesive layer. The electrically conductive adhesive layer is disposed between the electrically conductive shielding layer and the thermally conductive layer and is coextensive with the electrically conductive shielding layer. When the multilayer shielding film is placed on an electronic device mounted on a circuit board and under application of one or more of heat, vacuum, and pressure, the multilayer shielding film conforms to the electronic device and the electrically conductive adhesive layer adheres to the circuit board providing a seal between the multilayer shielding film and the circuit board.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Formable shielding film |
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