Three-dimensional (3D) memory with shared control circuitry using wafer-to-wafer bonding

Wafer-to-wafer bonding is used to form three-dimensional (3D) memory components such as 3D NAND flash memory with shared control circuitry on one die to access arrays on multiple dies. In one example, a non-volatile storage device includes a first die including a 3D array of non-volatile storage cel...

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Bibliographische Detailangaben

Hauptverfasser:	Majhi, Prashant, Jungroth, Owen, Fastow, Richard, Hasnat, Khaled
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INFORMATION STORAGE PHYSICS SEMICONDUCTOR DEVICES STATIC STORES
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