Selective deposition defects removal by chemical etch

Methods of depositing a film selectively onto a first substrate surface relative to a second substrate surface are described. The methods include exposing a substrate to a blocking molecule to selectively deposit a blocking layer on the first surface. A layer is selectively formed on the second surf...

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Bibliographische Detailangaben
Hauptverfasser: Zhou, Lei, Schmiege, Benjamin, Jackson, Michael S, Ma, Paul F, Wu, Liqi, Ke, Chang, Jian, Guoqiang, Anthis, Jeffrey W, Jain, Pratham
Format: Patent
Sprache:eng
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Zusammenfassung:Methods of depositing a film selectively onto a first substrate surface relative to a second substrate surface are described. The methods include exposing a substrate to a blocking molecule to selectively deposit a blocking layer on the first surface. A layer is selectively formed on the second surface and defects of the layer are formed on the blocking layer. The defects are removed from the blocking layer on the first surface.