Imaging device, manufacturing method, and substrate dividing method

There is provided semiconductor devices and methods of forming the same, including: a first substrate; and a second substrate adjacent to the first substrate, where a side wall of the second substrate includes one or more diced portions that can include a blade diced portion and a stealth diced port...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Yamaguchi, Masanari, Takachi, Taizo, Oinoue, Takashi, Ikebe, Yuki, Furuse, Shunsuke
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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