High density interconnects in an embedded trace substrate (ETS) comprising a core layer

A substrate that includes a first substrate portion, a second substrate portion and a second dielectric layer. The first substrate portion includes a core layer having a first core surface, and a plurality of core substrate interconnects, wherein the plurality of core substrate interconnects include...

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Bibliographische Detailangaben

Hauptverfasser:	Jomaa, Houssam, Kang, Kuiwon
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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