Fin formation for semiconductor device

A method of fabricating a semiconductor structure includes forming a plurality of semiconductor fins disposed on a semiconductor substrate, wherein at least one of the fins is an unwanted fin including a semiconductor material; providing a conformal protective layer over the plurality of semiconduct...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Lee, Dongseok, Moreau, David, Fan, Susan S, Yamashita, Tenko
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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