Dicing a wafer
A method for dicing a wafer includes scribing perforations in a wafer. The wafer has a monocrystalline structure and the perforations have a polycrystalline structure. The method also includes adhering the wafer to a top surface of a dicing tape and applying a downward force on a periphery of the di...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | Cayabyab, Jerry Gomez Barbadillo, Julian Carlo Concepc Aspuria, Jeniffer Otero Andaya, Alvin Lopez |
description | A method for dicing a wafer includes scribing perforations in a wafer. The wafer has a monocrystalline structure and the perforations have a polycrystalline structure. The method also includes adhering the wafer to a top surface of a dicing tape and applying a downward force on a periphery of the dicing tape. The downward force causes a bottom surface of the dicing tape to deform around a contour of a dome-shaped chuck, breaking the perforations in the wafer. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10615075B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10615075B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10615075B23</originalsourceid><addsrcrecordid>eNrjZOBzyUzOzEtXSFQoT0xLLeJhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfGhwYYGZoamBuamTkbGxKgBAC_lHh8</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Dicing a wafer</title><source>esp@cenet</source><creator>Cayabyab, Jerry Gomez ; Barbadillo, Julian Carlo Concepc ; Aspuria, Jeniffer Otero ; Andaya, Alvin Lopez</creator><creatorcontrib>Cayabyab, Jerry Gomez ; Barbadillo, Julian Carlo Concepc ; Aspuria, Jeniffer Otero ; Andaya, Alvin Lopez</creatorcontrib><description>A method for dicing a wafer includes scribing perforations in a wafer. The wafer has a monocrystalline structure and the perforations have a polycrystalline structure. The method also includes adhering the wafer to a top surface of a dicing tape and applying a downward force on a periphery of the dicing tape. The downward force causes a bottom surface of the dicing tape to deform around a contour of a dome-shaped chuck, breaking the perforations in the wafer.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200407&DB=EPODOC&CC=US&NR=10615075B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200407&DB=EPODOC&CC=US&NR=10615075B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Cayabyab, Jerry Gomez</creatorcontrib><creatorcontrib>Barbadillo, Julian Carlo Concepc</creatorcontrib><creatorcontrib>Aspuria, Jeniffer Otero</creatorcontrib><creatorcontrib>Andaya, Alvin Lopez</creatorcontrib><title>Dicing a wafer</title><description>A method for dicing a wafer includes scribing perforations in a wafer. The wafer has a monocrystalline structure and the perforations have a polycrystalline structure. The method also includes adhering the wafer to a top surface of a dicing tape and applying a downward force on a periphery of the dicing tape. The downward force causes a bottom surface of the dicing tape to deform around a contour of a dome-shaped chuck, breaking the perforations in the wafer.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOBzyUzOzEtXSFQoT0xLLeJhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfGhwYYGZoamBuamTkbGxKgBAC_lHh8</recordid><startdate>20200407</startdate><enddate>20200407</enddate><creator>Cayabyab, Jerry Gomez</creator><creator>Barbadillo, Julian Carlo Concepc</creator><creator>Aspuria, Jeniffer Otero</creator><creator>Andaya, Alvin Lopez</creator><scope>EVB</scope></search><sort><creationdate>20200407</creationdate><title>Dicing a wafer</title><author>Cayabyab, Jerry Gomez ; Barbadillo, Julian Carlo Concepc ; Aspuria, Jeniffer Otero ; Andaya, Alvin Lopez</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10615075B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Cayabyab, Jerry Gomez</creatorcontrib><creatorcontrib>Barbadillo, Julian Carlo Concepc</creatorcontrib><creatorcontrib>Aspuria, Jeniffer Otero</creatorcontrib><creatorcontrib>Andaya, Alvin Lopez</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Cayabyab, Jerry Gomez</au><au>Barbadillo, Julian Carlo Concepc</au><au>Aspuria, Jeniffer Otero</au><au>Andaya, Alvin Lopez</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Dicing a wafer</title><date>2020-04-07</date><risdate>2020</risdate><abstract>A method for dicing a wafer includes scribing perforations in a wafer. The wafer has a monocrystalline structure and the perforations have a polycrystalline structure. The method also includes adhering the wafer to a top surface of a dicing tape and applying a downward force on a periphery of the dicing tape. The downward force causes a bottom surface of the dicing tape to deform around a contour of a dome-shaped chuck, breaking the perforations in the wafer.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_epo_espacenet_US10615075B2 |
source | esp@cenet |
subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Dicing a wafer |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-06T07%3A07%3A59IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Cayabyab,%20Jerry%20Gomez&rft.date=2020-04-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS10615075B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |