Semiconductor package

The semiconductor package including a first semiconductor package including a first semiconductor package substrate, and a first semiconductor chip on the first semiconductor package substrate, an interposer disposed on the first semiconductor package is provided. Interposer electrically connects th...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Lee, Hee Seok, Kang, Tae Woo, Im, Yun Hyeok, Lee, Kyoung-Min, Kim, Yeong Seok
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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