Chemically amplified positive-type photosensitive resin composition

A chemically amplified positive-type photosensitive resin composition that can be well developed with an aqueous basic solution having low pH, a substrate with a photosensitive film formed from the composition, and a method for patterned resist film formation using the composition. The composition i...

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Hauptverfasser: Kuroiwa, Yasushi, Masuda, Yasuo
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creator Kuroiwa, Yasushi
Masuda, Yasuo
description A chemically amplified positive-type photosensitive resin composition that can be well developed with an aqueous basic solution having low pH, a substrate with a photosensitive film formed from the composition, and a method for patterned resist film formation using the composition. The composition includes an acid generator that produces an acid upon irradiation with an active ray or radiation; a resin whose solubility in alkali increases under the action of acid; and an organic solvent, in which a predetermined amount of an alkali-soluble resin soluble in an aqueous basic solution having a pH of 12 and containing alkali-soluble groups with hydrogen atoms in at least a part thereof is substituted with an acid-dissociative dissolution-controlling group contained in the resin.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10599036B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10599036B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10599036B23</originalsourceid><addsrcrecordid>eNrjZHB2zkjNzUxOzMmpVEjMLcjJTMtMTVEoyC_OLMksS9UtqSxIVSjIyC_JL07Ng4gpFKUWZ-YpJOfnQlTl5_EwsKYl5hSn8kJpbgZFN9cQZw_d1IL8-NTigsTk1LzUkvjQYEMDU0tLA2MzJyNjYtQAAA6RM-E</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Chemically amplified positive-type photosensitive resin composition</title><source>esp@cenet</source><creator>Kuroiwa, Yasushi ; Masuda, Yasuo</creator><creatorcontrib>Kuroiwa, Yasushi ; Masuda, Yasuo</creatorcontrib><description>A chemically amplified positive-type photosensitive resin composition that can be well developed with an aqueous basic solution having low pH, a substrate with a photosensitive film formed from the composition, and a method for patterned resist film formation using the composition. The composition includes an acid generator that produces an acid upon irradiation with an active ray or radiation; a resin whose solubility in alkali increases under the action of acid; and an organic solvent, in which a predetermined amount of an alkali-soluble resin soluble in an aqueous basic solution having a pH of 12 and containing alkali-soluble groups with hydrogen atoms in at least a part thereof is substituted with an acid-dissociative dissolution-controlling group contained in the resin.</description><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CHEMISTRY ; CINEMATOGRAPHY ; COMPOSITIONS BASED THEREON ; ELECTROGRAPHY ; HOLOGRAPHY ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; MATERIALS THEREFOR ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200324&amp;DB=EPODOC&amp;CC=US&amp;NR=10599036B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200324&amp;DB=EPODOC&amp;CC=US&amp;NR=10599036B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Kuroiwa, Yasushi</creatorcontrib><creatorcontrib>Masuda, Yasuo</creatorcontrib><title>Chemically amplified positive-type photosensitive resin composition</title><description>A chemically amplified positive-type photosensitive resin composition that can be well developed with an aqueous basic solution having low pH, a substrate with a photosensitive film formed from the composition, and a method for patterned resist film formation using the composition. The composition includes an acid generator that produces an acid upon irradiation with an active ray or radiation; a resin whose solubility in alkali increases under the action of acid; and an organic solvent, in which a predetermined amount of an alkali-soluble resin soluble in an aqueous basic solution having a pH of 12 and containing alkali-soluble groups with hydrogen atoms in at least a part thereof is substituted with an acid-dissociative dissolution-controlling group contained in the resin.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CHEMISTRY</subject><subject>CINEMATOGRAPHY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>MATERIALS THEREFOR</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHB2zkjNzUxOzMmpVEjMLcjJTMtMTVEoyC_OLMksS9UtqSxIVSjIyC_JL07Ng4gpFKUWZ-YpJOfnQlTl5_EwsKYl5hSn8kJpbgZFN9cQZw_d1IL8-NTigsTk1LzUkvjQYEMDU0tLA2MzJyNjYtQAAA6RM-E</recordid><startdate>20200324</startdate><enddate>20200324</enddate><creator>Kuroiwa, Yasushi</creator><creator>Masuda, Yasuo</creator><scope>EVB</scope></search><sort><creationdate>20200324</creationdate><title>Chemically amplified positive-type photosensitive resin composition</title><author>Kuroiwa, Yasushi ; Masuda, Yasuo</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10599036B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2020</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CHEMISTRY</topic><topic>CINEMATOGRAPHY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>MATERIALS THEREFOR</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>Kuroiwa, Yasushi</creatorcontrib><creatorcontrib>Masuda, Yasuo</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kuroiwa, Yasushi</au><au>Masuda, Yasuo</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Chemically amplified positive-type photosensitive resin composition</title><date>2020-03-24</date><risdate>2020</risdate><abstract>A chemically amplified positive-type photosensitive resin composition that can be well developed with an aqueous basic solution having low pH, a substrate with a photosensitive film formed from the composition, and a method for patterned resist film formation using the composition. The composition includes an acid generator that produces an acid upon irradiation with an active ray or radiation; a resin whose solubility in alkali increases under the action of acid; and an organic solvent, in which a predetermined amount of an alkali-soluble resin soluble in an aqueous basic solution having a pH of 12 and containing alkali-soluble groups with hydrogen atoms in at least a part thereof is substituted with an acid-dissociative dissolution-controlling group contained in the resin.</abstract><oa>free_for_read</oa></addata></record>
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subjects APPARATUS SPECIALLY ADAPTED THEREFOR
CHEMISTRY
CINEMATOGRAPHY
COMPOSITIONS BASED THEREON
ELECTROGRAPHY
HOLOGRAPHY
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
MATERIALS THEREFOR
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
THEIR PREPARATION OR CHEMICAL WORKING-UP
title Chemically amplified positive-type photosensitive resin composition
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-13T21%3A56%3A49IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Kuroiwa,%20Yasushi&rft.date=2020-03-24&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS10599036B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true