Flip chip integrated circuit packages with spacers

In a described example, an apparatus includes a semiconductor substrate and at least two pillar bumps formed on an active surface of the semiconductor substrate, the at least two pillar bumps extending away from the active surface and having ends spaced from the semiconductor substrate with solder m...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Guevara, Rafael Jose Lizares, Baello, James Raymond Maliclic
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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