Semiconductor device and a corresponding method of manufacturing semiconductor devices

A semiconductor device includes a passivation layer over a dielectric layer, a via through the passivation layer and the dielectric layer, an interconnection metallization arranged over said at least one via; said passivation layer underlying peripheral portions of said interconnection metallization...

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Bibliographische Detailangaben
Hauptverfasser: Venegoni, Ivan, Colpani, Paolo, Milanesi, Francesca, Sciarrillo, Samuele
Format: Patent
Sprache:eng
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